Kontron Showcases A Latest COM-HPC Client Module At COMPUTEX

Come visit our booth during COMPUTEX to have a closer look at our COMh-caAP, a COM-HPC® client module for your own carrier board or new design tailored to your own chassis or systems.

Kontron COMh-caAP, a COM-HPC® client module in Size A form factor of 95 mm x 120 mm with a 12th Gen Intel® Core™ processor, is perfect for high-performance computing in resource-intensive areas such as networking, automation and measurement. The COMh-caAP features an optimized power-performance ratio with a power consumption of 15 W to 45 W TDP (Thermal Design Power); in multithreading up to 20 threads can be processed with 14 cores. The module also comes with up to 64 GByte of DDR5 memory and up to 2.5 Gbit Ethernet, including TSN support. As storage medium, an NVME SSD up to one terabyte can be optionally integrated onboard. The COM-HPC® module also supports Thunderbolt (display and PCIe 5.0 via USB).

Plan your schedule now to attend COMPUTEX! We are looking forward to meeting you at our booth.

COMPUTEX Information

> Date: June 4 - 7, 2024
> Venue: Nangang Exhibition Center, Taipei, Taiwan (Transportation Info)
> Kontron Booth: Hall 2, 1F, #P0110

About Kontron

Kontron is a global leader in IoT / Embedded Computing Technology (ECT) and offers individual solutions in the areas of Internet of Things (IoT) and Industry 4.0 through a combined portfolio of hardware, software and services. With its standard and customized products based on highly reliable state-of-the-art technologies, Kontron provides secure and innovative applications for a wide variety of industries. As a result, customers benefit from accelerated time-to-market, lower total cost of ownership, extended product lifecycles and the best fully integrated applications. For more information, please visit www.kontron.com, dial +886 2 2799 2789 or email SalesAsia@kontron.com.