3.5" Single Board Computer with 11th Gen Intel® Core™ U-Series and Celeron® 6000 Series Processors

Kontron, a leading global provider of IoT / Embedded Computing Technology (ECT), is pleased to announce the launch of a new generation of 3.5" single board computers, named 3.5"-SBC-TGL, powered by the latest 11th Generation Intel® Core™ U-Series and Celeron® 6000 Series processors, for integration into low-latency, graphics-demanding and / or AI-enabled embedded systems designed for smart retail, industrial automation, smart city, healthcare and similar IoT / AIoT related applications.

Native AI Inferencing Capabilities

Powered by 11th Generation Intel® Core™ U-Series and Celeron® 6000 Series processors integrated with Intel's next-generation Iris® Xe Graphics, 3.5"-SBC-TGL delivers up to 23% faster computing performance and up to 2.95 times faster graphics performance in comparison with its counterparts based on the previous generation Intel® Core™ processors. The integrated GPU is able to handle up to 96 execution units. In addition, built-in Intel® Deep Learning Boost (Intel® DL Boost), running either on the integrated GPU or on the CPU, can help accelerate AI workloads, such as image classification, speech recognition, language translation and object detection. As a result, 3.5"-SBC-TGL is capable of providing sufficient AI inference performance without needing an additional dedicated graphics card. That can reduce system integration costs, power consumption, thermal output and space requirements.

8K UHD Output Support

Besides the massive graphics performance boost mentioned above, 3.5"-SBC-TGL has two DisplayPort connectors on the I/O panel and can support up to two channels of 8K video output at a frame rate of 60 frames per second with virtually no lag, dropped frames or stuttering. Alternatively, it can output four DisplayPort signals simultaneously, via two additional DisplayPort connectors routed from the extended B2B connector, to drive four independent displays running 4K video at 60 frames per second in case the board is integrated into a box system for 2 x 2 / 4 x 1 video wall, control room visualization or other multi-monitor applications.

Faster Networking Performance

In addition to a GbE LAN port, 3.5"-SBC-TGL offers another 2.5 GbE LAN port to satisfy the growing broadband networking needs. Partial models (with industrial GRE series processors) support Intel® Time Coordinated Computing (Intel® TCC) technology and can synchronize networks of connected components within a system itself to achieve network accuracy within a microsecond. By further pairing with Time-Sensitive Networking (TSN) standards, developers can enable ultra-reliable low-latency networking for connected devices between systems.

High-speed Data Transfer Rates

Additionally, 3.5"-SBC-TGL comes with other new-generation interfaces to support higher data transfer rates between memory, storage and peripheral devices. They include two DDR4 SO-DIMM sockets that support up to 3200 MHz DDR4 RAM modules; four USB 3.2 Gen 2 ports that support up to 10 Gb/s data transfer; one SATA 3.0 connector that provides up to 6 Gb/s data throughput; and three next-generation M.2 expansion slots with Key B, Key E and Key M physical interface form respectively. The Key M slot supports PCIe x4 signal and can host a NVMe SSD at up to 32 Gb/s. The Key E slot supports Intel® CNVi Wi-Fi module and can deliver up to 1.73 Gb/s data rate.

Great Scalability In System Performance And Functionality

3.5"-SBC-TGL is equipped with a board-to-board connector and allows system developers to add a daughter board for the expansion of additional I/O ports or functions depending on application scenarios. As mentioned above, developers can expand two additional DisplayPort connectors for video wall or multi-monitor applications. Also, the board supports configurable TDP from 12 W to 28 W for the models with Core™ processors. That can provide flexibility to developers to design a system according to the cooling techniques they use and the applications scenarios they target. In general, lower TDP, typically 15 W or less, makes easy the development of a fanless, noiseless and even high IP (Ingress Protection) rating system, while the higher TDP makes possible a more powerful system for performance-demanding applications.

A Wide Range Of Applications From Domestic To Commercial And Industrial

3.5"-SBC-TGL has three types of variants to support commercial-grade, extended commercial-grade and industrial-grade operating temperatures of 0 °C ~ 60 °C, -20 °C ~ 70 °C and -40 °C ~ 85 °C respectively. It complies with the interference limits for a Class B device, pursuant to CE / FCC regulations. Also, developers can choose either a conventional SATA hard disk or a reliable M.2 SSD for their system's storage device depending on needs and budget. Therefore, the board can be integrated into a variety of systems designed for applications ranged from domestic to commercial and even harsh industrial environments.

Securer Platform For Remote Management

3.5"-SBC-TGL integrates a TPM 2.0 security chip on the board and partial models (with Core™ i7 / i5 processors) support Intel® vPro® platform with Intel® AMT (Active Management Technology). That not only ensures a more robust security architecture to defend against increasingly sophisticated cyberattacks, but also allows administrators to monitor, manage, upgrade and / or recover devices via remote access.

The list below summarizes the features and specifications of 3.5"-SBC-TGL.

Features & Specifications

• Native AI Inferencing Capabilities
  • 11th Gen Intel® Core™ U-Series processors
  • Intel® Celeron® 6000 Series processors
  • Intel® Iris® Xe Graphics (Core™ i7 / i5)
  • Intel® UHD Graphics (Core™ i3 / Celeron®)
  • Intel® Deep Learning Boost support
• Up To 2x 8K UHD / 4x 4K UHD Output Support
  • 2x DP on rear
  • 2x Additional DP support via B2B connector
• Faster Networking Performance
  • 1x 2.5 GbE LAN, 1x GbE LAN for Ethernet
  • Intel® Time Coordinated Computing / Time-sensitive Networking support (Core™ GRE Series)
• High-speed Data Transfer Rates
  • 2x DDR4 (3200 MHz) SO-DIMM memory socket
  • 4x USB 3.2 Gen 2 (10 Gb/s), 4x USB 2.0 for USB device connection
  • 1x SATA 3.0 (6 Gb/s) for storage device
  • 1x M.2 Key B for WWAN, SSD or other possible expansion
  • 1x M.2 Key E for WLAN (Intel® CNVi support, up to 1.7s Gb/s), Bluetooth or other possible expansion
  • 1x M.2 Key M for SSD storage with NVMe (up to 32 Gb/s) support
• Great Scalability In System Performance And Functionality
  • Processor with configurable TDP from 12 W to 28 W (Core™)
  • 1x B2B connector for DDI, PCIe, SM Bus, I2C, UART, GSPI
• A Wide Range Of Applications From Domestic To Commercial And Industrial
  • Commercial grade operating temperature: 0 °C ~ 60 °C
  • Extended commercial grade operating temperature: -20 °C ~ 70 °C
  • Industrial grade operating temperature: -40 °C ~ 85 °C
  • CE Class B & FCC Class B complaint
• Securer Platform For Remote Management
  • TPM 2.0 support
  • Intel® vPro® support (Core™ i7 / i5)
• Other I/O Interfaces
  • 1x LVDS for all-in-one system integration
  • 2x RS232/422/485 for serial device connection
  • 8-bit DIO for device / signal control

Rear I/O Ports

Click here for more information about 3.5”-SBC-TGL or contact your account manager for any industrial application project specification.

About Kontron

Kontron, a global leader in IoT / Embedded Computing Technology (ECT), offers a combined portfolio of secure hardware, middleware and services for Internet of Things (IoT) and Industry 4.0 applications. With its standard products and tailor-made solutions based on highly reliable state-of-the-art embedded technologies, Kontron provides secure and innovative applications for a variety of industries. As a result, customers benefit from accelerated time-to-market, reduced total cost of ownership, product longevity and the best fully integrated applications overall. For more information, please visit www.kontron.com, dial +886 2 2799 2789 or email SalesAsia@kontron.com.